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Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries

著者名:
Eom, D.-H.
Hong, Y.-K.
Lee, S.-H.
Park, J.-Y.
Myung, J.-J.
Park, J.-G.
Kim, K.-S.
Song, H.-S.
Park, H.-S.
Choi, Y.-S.
さらに 5 件
掲載資料名:
Chemical Mechanical Planarization : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2002-1
発行年:
2002
開始ページ:
226
終了ページ:
236
総ページ数:
11
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773294 [1566773296]
言語:
英語
請求記号:
E23400/2002-1
資料種別:
国際会議録

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