Device Applications Using Bonded Thick SOI Wafers

Device Applications Using Bonded Thick SOI Wafers

著者名:

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2001-27

発行年:

2001

開始ページ:

214

終了ページ:

231

総ページ数:

18

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773607 [1566773601]

言語:

英語

請求記号:

E23400/200127

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014031
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding ; Fall Meeting of the Electrochemical Society
回次:	6th ; 2001
会議開催地:	San Francisco, CA, USA
会議開催年:	2001.09.00

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