Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer
- 著者名:
Suder, S.L. Hurley, R. Li, F.X. Bain, M. Baine, P. MeNeill, D.W. Armstrong, B.M. Gamble, H.S. - 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2001-27
- 発行年:
- 2001
- 開始ページ:
- 19
- 終了ページ:
- 19
- 総ページ数:
- 1
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773607 [1566773601]
- 言語:
- 英語
- 請求記号:
- E23400/200127
- 資料種別:
- 国際会議録
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