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Overview on Some Recent Advances in Wafer Bonding Technologies

著者名:
Moriceau, H.
Fournel, F.
Rayssac, O.
Cartier, A.M.
Morales, C.
Pocas, S.
Zussy, M.
Jalaguier, E.
Biasse, B.
Bataillou, B.
Papon, A.M.
Lagahe, C.
Aspar, B.
Maleville, C.
Leterte, F.
Ghyselen, B.
Barge, T.
さらに 12 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2001-27
発行年:
2001
開始ページ:
1
終了ページ:
16
総ページ数:
16
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
言語:
英語
請求記号:
E23400/200127
資料種別:
国際会議録

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