Blank Cover Image

Comparative Study Of Cu Seeding Layer By CVD And Electroless Deposition Methods For VLSI CU Interconnect

著者名:
掲載資料名:
Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2001-17
発行年:
2001
開始ページ:
35
終了ページ:
44
総ページ数:
10
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773508 [1566773504]
言語:
英語
請求記号:
E23400/200117
資料種別:
国際会議録

類似資料:

1 国際会議録 Activation Methods For Electroless Copper Deposition Of Seeding Layer For ULSI Copper Interconnect Metallization

Tse, M S, Tan, K T, Goh, W L, Liu, K Y

Electrochemical Society
7 国際会議録 Growth of Carbon Nanofibers on Electroless Ni-P Alloy Catalyst

Tsai, T.K., Liu, W.L., Hsieh, S.H., Chen, W.J.

Materials Research Society
2 国際会議録 Effects of Seeding Layers on Electroless Copper Deposition

Liu, K. Y., Tse, M. S., Goh, W. L.

MRS - Materials Research Society
8 国際会議録 Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSI

Lee, C. H., Fejes, P. L., York, B. R., Elwell, S. A., Carnes, R. O., Lee, J. Y., Grivna, G. M., Bauguess, S. W., Dreyer, …

MRS - Materials Research Society
3 国際会議録 Process monitoring of LPCVD silicon nitride and polysilicon by variable-angle spectroscopic ellipsometry

Loh,S.Y., Wong,T.K.S., Tse,M.S., Goh,W.L.

SPIE-The International Society for Optical Engineering
9 国際会議録 A Study On CVD TaN As A Diffusion Barrier For Cu Interconnects

Im, S., Kim, S., Park, K., Cho, S., Kim, K.

Materials Research Society
4 国際会議録 Coopper Oxide Removal By In-situ Plasma Pre-Treatment For Improved Copper To Dielectric Barrier Adhesion

Lim, Y.K., Goh, W.L., Tse, M.S., Tse, T.Y., Seet, C.S., Lu, W., Randall, Cha, C.L., Adebanjo, Ricky, Steiner, Kurt G.

Electrochemical Society
10 国際会議録 Buried Metallic Layer with Silicon Direct Bonding

Goh, W.L., Campbell, D.L., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
5 国際会議録 A Comparative Study of Nickel Silicide Formation Using a Titanium Cap Layer and a Titanium Interlayer

Tan, W.L., Pey, K.L., Chooi, Simon Y.M., Ye, J.H.

Materials Research Society
11 国際会議録 Study of Nucleation of Electroless Cu Deposition on Pd

Amster, R., Johnson, B., Vanasupa, L. S.

MRS - Materials Research Society
6 国際会議録 Characterization and reduction of copper chemical-mechanical-polishing-induced scratches

Teo, T.Y., Goh, W.L., Leong, L.S., Lim, V.S.K., Tse, T.Y., Chan, L.

SPIE-The International Society for Optical Engineering
12 国際会議録 Electroless Cu and barrier layers for subhalf-micron multilevel interconnects

Lopatin,S., Shacham-Diamand,Y., Dubin,V., Vasudev,P.K.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12