Blank Cover Image

Electromigration Failure Modes in CU Metallization*

著者名:
Gall, M.
Capasso, C.
Thrasher, S.
Zhao, L.
Muiski, P.
Hernandez, R.
Herrick, M.
Angyal, M.
Boeck, B.
Kawasaki, H.
さらに 5 件
掲載資料名:
ULSI Process Integration : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2001-2
発行年:
2001
開始ページ:
410
終了ページ:
425
総ページ数:
16
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773089 [1566773083]
言語:
英語
請求記号:
E23400/2001-2
資料種別:
国際会議録

類似資料:

1 国際会議録 Electromigration failure modes and Blech effect in single-inlaid Cu interconnects

Thrasher,S., Capasso,C., Zhao,L., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Kawasaki,H.

SPIE-The International Society for Optical Engineering
7 国際会議録 Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology

Venkatraman, R., Jain, A., Farkas, J., Mendonca, J., Hamilton, G., Capasso, C., Denning, D., Simpson, C., Rogers, B., …

MRS - Materials Research Society
2 国際会議録 Dependence of EM performance on linewidth for Cu dual-inlaid structures

Zhao,L., Capasso,C., Marathe,A., Thrasher,S., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Gall,M., Kawasaki,H.

SPIE-The International Society for Optical Engineering
8 国際会議録 Scalling of Statistical and Physical Electromigration Characteristics in Cu Interconnects

Gall, Martin, Hauschildt, Meike, Justison, Patrick, Ramakrishna, Konero, Hernandez, Richard, Herrick Matthew, Michaelson …

Materials Research Society
3 国際会議録 Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects

Hauschildt, M., Gall, M., Thrasher, S., Justison, P., Michaelson, L., Hernandez, R., Kawasaki, H., Ho, P.S.

Materials Research Society
9 国際会議録 Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects

Gall,M., Muller, J., Jawarani, D., Capasso, C., Hernanndez, R., Kawasaki, H.

MRS - Materials Research Society
4 国際会議録 Statistical Modeling and Experimental Verification of Electromigration Time to Fail Distribution in Metal Interconnects

Capasso, C., Gall, M., Anderson, S., Jawarani, D., Hernandez, R., Kawasaki, H.

Electrochemical Society
10 国際会議録 Process Control Challenges and Solutions: TEOS, W, and Cu CMP

Angyal, M., Boeck, B., Cope, J., Dang, C., Grudowski, P., Islam, R., Kolagunta, V., Mendonca, J., Pettinato, C., …

Materials Research Society
5 国際会議録 Diffusional Void Growth in Dual-Inlaid Cu Interconnects

Jawarani, D., Gall, M., Capasso, C., Clark, G., Hernandez, R., Kawasaki, H.

Electrochemical Society
11 国際会議録 A Comparative Study on Electromigration Failure Mechanism Between Near-Bamboo and Bamboo Al(Cu) Two-Level Structure

Wang, P.-H., Lee, C., Jawarani, D., Kawasaki, H., Ho, P. S.

MRS - Materials Research Society
6 国際会議録 Statistical Evaluation of Stressmigration Reliability in Al-Cu Interconnects

Jawarani, D., Gall, M., Capasso, C., Muller, J., Hernandez, R., Kawasaki, H.

MRS - Materials Research Society
12 国際会議録 Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSI

Lee, C. H., Fejes, P. L., York, B. R., Elwell, S. A., Carnes, R. O., Lee, J. Y., Grivna, G. M., Bauguess, S. W., Dreyer, …

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12