Blank Cover Image

The Chemical-Mechanical Polishing of Copper with Model Slurries

著者名:
掲載資料名:
Electrochemical science and technology of copper : proceedings of the international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2000-30
発行年:
2000
開始ページ:
103
終了ページ:
116
総ページ数:
14
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772976 [1566772974]
言語:
英語
請求記号:
E23400/200030
資料種別:
国際会議録

類似資料:

1 国際会議録 Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects

Sainio, C., Duquette, D.J.

Electrochemical Society
7 国際会議録 Pulsed Electrodeposition of Copper from Alkaline and Acid Baths for Metallization in Integrated Circuits

Lee, C.Y., Duquette, D.J.

Electrochemical Society
2 国際会議録 Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries

Sainio, C.A., Duquette, D.J.

Electrochemical Society
8 国際会議録 Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing

Abiade, J.T., Yeruva, S., Moudgil, B., Kumar, D., Singh, R.K.

Materials Research Society
3 国際会議録 SURFACE LAYER FORMATION DURING THE CHEMICAL MECHANICAL POLISHING OF COPPER THIN FILMS

Steigerwald, J. M., Murarka, S. P., Duquette, D. J., Gutmann, R. J.

MRS - Materials Research Society
9 国際会議録 Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing

Lee, S.-M., Abiade, J., Choi, W., Singh, R.

Electrochemical Society
4 国際会議録 Synthesis of Model Alumina Slurries for Damascene Patterning of Copper

Lee, Byung-Chan, Duquette, David J., Gutmann, Ronald J.

Materials Research Society
10 国際会議録 Study of Slurry Chemistry in Chemical Mechanical Polishing (CMP) of Copper

Lee, Seung-Mahn, Mahajan, Uday, Chen, Zhan, Singh, Rajiv K.

Electrochemical Society
5 国際会議録 CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES

Yang, K., Gutmann, R. J., Murarka, S. P., Stonebaker, E., Atkins, H.

MRS - Materials Research Society
11 国際会議録 Pulsed Electrodeposition of Copper Metallization from an Alkali Bath

Krishnamoorthy, A., Lee, C.Y., Duquette, D.J., Murarka, S.P.

Electrochemical Society
6 国際会議録 Chemical-Mechanical Planarization Issues in Patterning Copper and Aluminum Interconnects with Magnetic Liners

Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J.

Electrochemical Society
12 国際会議録 Electrochemical Testing of Tantalum and Copper in Chemical Mechanical Polishing Slurries

Z. Lin, H. Li, R. Schmidt, R. Baker

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12