Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum

Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum

著者名:

掲載資料名:

Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2000-27

発行年:

2000

開始ページ:

32

終了ページ:

46

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772945 [156677294X]

言語:

英語

請求記号:

E23400/200027

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013996
シリーズID:	PA00000028
会議名:	Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
回次:	2000 ; 198th
会議開催地:	Phoenix, AZ, USA
会議開催年:	2000.10.22-2000.10.27

類似資料:

1 国際会議録 Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum Jindal, Anurag, Li, Ying, Babu, S.V. Materials Research Society	7 国際会議録 The Effects of Particle Adhesion in Chemical Mechanical Polishing Lu, Zhenyu, Babu, S. V., Matijevic, Egon Materials Research Society
2 国際会議録 Slurry Retention and Transport During Chemical-Mechanical Polishing of Copper Jindal, Anurag, Li, Ying, Narayanan, Satish, Bobu, S.V. Materials Research Society	8 国際会議録 Electrochemical Testing of Tantalum and Copper in Chemical Mechanical Polishing Slurries Z. Lin, H. Li, R. Schmidt, R. Baker Electrochemical Society
3 国際会議録 Copper Dissolution and Chemical-Mechanical Polishing in Acidic Media Luo, Q., Campbell, D.R., Babu, S.V. Electrochemical Society	9 国際会議録 Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries Gorantla, Venkata, Babu, S. V. Materials Research Society
4 国際会議録 Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP) Hong, Youngki, Patri, Udaya B., Ramakrishnan, Suresh, Babu, S.V. Materials Research Society	10 国際会議録 Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration Lu, J., Garland, J. E., Petite, C. M., Babu, S. V., Roy, D. Materials Research Society
5 国際会議録 Effect of Abrasive Particles on Chemical Mechanical Polishing Performance Tamboli, D., Banerjee, G., Chang, S., Waddell, M., Butcher, I., Arefeen, Q., Hymes, S. Electrochemical Society	11 国際会議録 Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives J.C. Tsai, J.F. Kao Trans Tech Publications
6 国際会議録 The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing Tsai, H.J., Chang, C.C., Jeng, Y.R., Chen, S.L. Trans Tech Publications	12 国際会議録 Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper Jung, Su-Ho, Singh, Rajiv K. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12