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Effect of Thiourea on Electrodeposition of Copper from Acid Sulfate Solution

著者名:
掲載資料名:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2000-27
発行年:
2000
開始ページ:
6
終了ページ:
14
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
言語:
英語
請求記号:
E23400/200027
資料種別:
国際会議録

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