Aqueous Slurries in Chemical Mechanical Polishing: Adsorption of Silicate Ions by Ceria

Aqueous Slurries in Chemical Mechanical Polishing: Adsorption of Silicate Ions by Ceria

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2000-26

発行年:

2000

開始ページ:

222

終了ページ:

228

総ページ数:

7

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772938 [1566772931]

言語:

英語

請求記号:

E23400/200026

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013995
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	4th ; 198th
会議開催地:	Phoeniz, AZ, USA
会議開催年:	2000.10.23-2000.10.25

類似資料:

1 国際会議録 Cerium Oxide Slurries in Chemical Mechanical Polishing: Silica/Ceria Interactions Suphantharida, P., Osaco-Asare, K. Electrochemical Society	7 国際会議録 Estimation of W Polishing Characteristics During W-CMP with Iodate-Based Slurries Anik, M., Osseo-Asare, K. Electrochemical Society
2 国際会議録 Chemical-Mechanical Polishing of Metals: the Role of Metal Concentration Gradient Osseo-Asare, K. Electrochemical Society	8 国際会議録 Cathodic Reactions in Copper Chemical Mechanical Polishing: The Cu/Fe3+ and Cu/H202 Systems Al-Hinai, Ashraf T., Osseo-Asare, Kwadwo Electrochemical Society
3 国際会議録 Chemical-Mechanical Polishing of Tungsten: An Electrophoretic Mobility Investigation of Alumina-Tungstate Interactions Osseo-Asare, K., Khan, A. Electrochemical Society	9 国際会議録 Electrodeposition of Iron in Aqueous Ferrous Sulfate Solution: Role of Ammonium Ion K. Osseo-Asare, M. Deelo, K. Weil Electrochemical Society
4 国際会議録 Colloids and Surfaces in Chemical Mechanical Polishing: An Adsorptive Model for Abrasive Particle/Oxide Substrate Interactions Osseo-Asare, K. Electrochemical Society	10 国際会議録 Tungsten CMP: Reduction Behavior of Iodate Ion on Tungsten Anik, M., Osseo-Asare, K. Electrochemical Society
5 国際会議録 Concentration Gradient Effects in Tungsten Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	11 国際会議録 Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing Abiade, J.T., Yeruva, S., Moudgil, B., Kumar, D., Singh, R.K. Materials Research Society
6 国際会議録 Oxidation and Dissolution Characteristics of Tungsten: Application To Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	12 国際会議録 Chemical-Mechanical Polishing of Copper in Glycerol Based Slurries Kumar, K. S., Murarka, S. P. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12