Effect of Organic Acids in Slurry on Copper CMP

Effect of Organic Acids in Slurry on Copper CMP

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2000-26

発行年:

2000

開始ページ:

201

終了ページ:

211

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772938 [1566772931]

言語:

英語

請求記号:

E23400/200026

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013995
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	4th ; 198th
会議開催地:	Phoeniz, AZ, USA
会議開催年:	2000.10.23-2000.10.25

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