Optimal Size Distribution of CMP Slurries for Enhanced Polishing with Minimal Defects
- 著者名:
- 掲載資料名:
- Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-37
- 発行年:
- 1999
- 開始ページ:
- 369
- 終了ページ:
- 381
- 総ページ数:
- 13
- 出版情報:
- Pennington, N. J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772600 [1566772605]
- 言語:
- 英語
- 請求記号:
- E23400/99-37
- 資料種別:
- 国際会議録
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Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing
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Remote Microwave Plasma Enhanced CVD of Low Dielectric Constant SiOxFy Films From FASi-4 and Oxygen
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