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Study of Slurry Chemistry in Chemical Mechanical Polishing (CMP) of Copper

著者名:
掲載資料名:
Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-37
発行年:
1999
開始ページ:
187
終了ページ:
192
総ページ数:
6
出版情報:
Pennington, N. J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772600 [1566772605]
言語:
英語
請求記号:
E23400/99-37
資料種別:
国際会議録

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