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Selective Fusion Bonding by Surface Roughness Control

著者名:
Gui, C.
Oosterbroek, R.E.
Berenschot, J.W.
Schlautmann, S.
Lammerink, R.S.J.
van den Berg, A.
Elwenspoek, M.C.
さらに 2 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-35
発行年:
1999
開始ページ:
318
終了ページ:
325
総ページ数:
8
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
言語:
英語
請求記号:
E23400/99-35
資料種別:
国際会議録

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