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Bonding of Hydrogen-Terminated Silicon: Thermal Evolution of the Interfacial Properties

著者名:
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-35
発行年:
1999
開始ページ:
224
終了ページ:
231
総ページ数:
8
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
言語:
英語
請求記号:
E23400/99-35
資料種別:
国際会議録

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