Blank Cover Image

The Smart-Cut Process: Status and Developments

著者名:
Aspar, B.
Lagahe, C.
Moriceau, H.
Jalaguier, E.
Mas, A.
Rayssac, O.
Biasse, Soubie; B.
Bruel, M.
Auberton-Hevre, A.J.
Barge, T.
Letertre, F.
Maleville, C.
さらに 7 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-35
発行年:
1999
開始ページ:
48
終了ページ:
59
総ページ数:
12
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
言語:
英語
請求記号:
E23400/99-35
資料種別:
国際会議録

類似資料:

1 国際会議録 Smart-Cut Technology: An Industrial Application of Ion-Implantation-Induced Cavities

Aspar, B., Lagahe, C., Moriceau, H., Soubie, A., Bruel, M., Auberton-Herve, A. J., Barge, T., Maleville, C.

MRS - Materials Research Society
7 国際会議録 Overview on Some Recent Advances in Wafer Bonding Technologies

Moriceau, H., Fournel, F., Rayssac, O., Cartier, A.M., Morales, C., Pocas, S., Zussy, M., Jalaguier, E., Biasse, B., …

Electrochemical Society
2 国際会議録 Unibond SOI wafers achieved by Smart-Cut process

Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T.

Electrochemical Society
8 国際会議録 Physical phenomena involved in the Smart Cut process

Moleville, C, Aspar, B, Powneyrol, T, Moriceau, H, Bract, M, Auberton-Herve, A J, Barge, T, Metral, F

Electrochemical Society
3 国際会議録 Unibond SOI Wafers Achieved by Smart-Cut Process

Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T.

Electrochemical Society
9 国際会議録 Smart Cut Technology: the path for advanced SOI substrates

Moriceau, H., Lagahe-Blanchard, C., Fournel, F., Pocas, S., Jalaguier, E., Perreau, P., Deguet, C., Ernst, T., Beaumont, …

Kluwer Academic Publishers
4 国際会議録 A New Characterisation Process Used to Qualify SOI Films

Moriceau, H, Aspar, B, Bruel, M, Cartier, A M, Morales, C, Soubie, A, Barge, T, Bressot, S, Maleville, C, Auberton, A I

Electrochemical Society
10 国際会議録 Single-Crystal Semiconductor Layer Delamination and Transfer Through Hydrogen Implantation

Bruel, M., Aspar, B., Moriceau, H., Jalaguier, E., Lagahe, C.

Electrochemical Society
5 国際会議録 INVITED: SILICON ON INSULATOR WAFERS USING THE SMART CUT TECHNOLOGY

Auberton-Herve, A.J., Barge, T., Metral, F., Bruel, M., Aspar, B., Moriceau, H.

Electrochemical Society
11 国際会議録 Detailed Characterization of Wafer Bonding Mechanisms

Maleville, C., Rayssac, O., Moriceau, H., Blasse, B., Baroux, L., Aspar, B., Bruel, M.

Electrochemical Society
6 国際会議録 Smart-Cut(R): The Basic Fabrication Process for Unibond(R) SOI Wafers

Auberton-Herve, A. J., Barge, T., Metral, F., Bruel, M., Aspar, B., Meleville, C., Moriceau, H., Poumeyrol, T.

MRS - Materials Research Society
12 国際会議録 QuaSiC Smart-Cut Substrates for SiC High Power Devices

Letertre, F., Jalaguier, E., Di Cioccio, L., Templier, F., Bluet, J.M., Banc, C., Matko, I., Chenevier, B., Bano, E., …

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12