A Sequential Copper Plating Process for Multiple Feature Sizes for HDI Applications

A Sequential Copper Plating Process for Multiple Feature Sizes for HDI Applications

著者名:

掲載資料名:

Electrochemical technology applications in electronics : proceedings of the third international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

99-34

発行年:

1999

開始ページ:

111

終了ページ:

119

総ページ数:

9

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772570 [1566772575]

言語:

英語

請求記号:

E23400/99-34

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013962
シリーズID:	PA00000028
会議名:	International Symposium on Electrochemical Technology Applications in Electronics
回次:	3rd
会議開催地:	Honolulu, Hawaii, USA
会議開催年:	1999.10.20-1999.10.22

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