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The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry : Feasibility of RTA for Film Stabilization

著者名:
Simpson, C.R.
Baker, B.C.
Herrick, M.
Basser, P.
Hamilton, G.
Weitzman, E.
Hey, P.
Subramanyan, S.
Chen, M.
Shin, H. Seon
Dordi, Y.
Cheung, R.
Carl, D.
さらに 8 件
掲載資料名:
Interconnect and contact metallization for ULSI : proceedings of the international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-31
発行年:
1999
開始ページ:
130
終了ページ:
138
総ページ数:
9
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772549 [1566772540]
言語:
英語
請求記号:
E23400/99-31
資料種別:
国際会議録

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