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Method of Reducing the Pattern Effects on B Penetration and TED Effect by In-Situ Poly Deposition at Wafer Backside before Rapid Thermal Processing

著者名:
Shih, J.-R.
Lee, J.H.
Lin, B.L.
Chen, S.H.
Hwang, H.L.
Diaz, C.H.
Liew, B.K.
さらに 2 件
掲載資料名:
ULSI process integration : proceedings of the first international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-18
発行年:
1999
開始ページ:
291
終了ページ:
300
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772419 [1566772419]
言語:
英語
請求記号:
E23400/99-18
資料種別:
国際会議録

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