Modulated Reverse Electric Field Copper Metallization for High Density Interconnect and Very Large Scale Integration Applications

Modulated Reverse Electric Field Copper Metallization for High Density Interconnect and Very Large Scale Integration Applications

著者名:

Sun, J.J.

掲載資料名:

Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

99-9

発行年:

1999

開始ページ:

201

終了ページ:

211

総ページ数:

11

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772310 [1566772311]

言語:

英語

請求記号:

E23400/99-9

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013939
シリーズID:	PA00000028
会議名:	Symposium on Electrochemical processing in ULSI fabrication and semiconductor/metal deposition
回次:	2nd
会議開催地:	Seattle, Washington, USA
会議開催年:	1999.05.03-1999.05.06

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