Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing)
- 著者名:
- 掲載資料名:
- Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 98-7
- 発行年:
- 1998
- 開始ページ:
- 246
- 終了ページ:
- 254
- 出版情報:
- Pennington, N. J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772013 [156677201X]
- 言語:
- 英語
- 請求記号:
- E23400/98-7
- 資料種別:
- 国際会議録
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American Society of Mechanical Engineers |
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SPIE-The International Society for Optical Engineering |
9
国際会議録
Further Investigation of Effects of pH on Silicon Dioxide Chemical Mechanical Polishing (CMP)
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EFFECT OF POLISHING PAD MATERIAL PROPERTIES ON CHEMICAL MECHANICAL POLISHING (CMP) PROCESSES
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