A Cautious Approach to the Removal of Ta in the CMP Polishing of Cu-Ta Structures
- 著者名:
- 掲載資料名:
- Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 98-7
- 発行年:
- 1998
- 開始ページ:
- 119
- 終了ページ:
- 125
- 出版情報:
- Pennington, N. J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772013 [156677201X]
- 言語:
- 英語
- 請求記号:
- E23400/98-7
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
8
国際会議録
Copper CMP for Dual Damascene Technology: Some Considerations on the Mechanism of Cu Removal
Materials Research Society |
Electrochemical Society |
9
国際会議録
Copper CMP for Dual Damascene Technology: Some Considerations on the Mechanism of Cu Removal
Electrochemical Society |
Electrochemical Society |
Society of Photo-optical Instrumentation Engineers |
Materials Research Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |