Chemical Mechanical Polishing of Copper Using Silica Slurry

Chemical Mechanical Polishing of Copper Using Silica Slurry

著者名:

掲載資料名:

Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

98-6

発行年:

1998

開始ページ:

195

終了ページ:

205

総ページ数:

11

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772006 [1566772001]

言語:

英語

請求記号:

E23400/98-6

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013909
シリーズID:	PA00000028
会議名:	Symposia on Electrochemical Processing in ULSI Fabrication ; Meeting of the Electrochemical Society ; Interconnect and Contact Metallization: Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
回次:	1st ; 193rd ; 1998 ; 194th
会議開催地:	San Diego, CA, USA ; San Diego, CA, USA ; Boston, MA, USA ; Boston, MA, USA
会議開催年:	1998.05.04-1998.05.05 ; 1998.05.04-1998.05.05 ; 1998.11.01-1998.11.06 ; 1998.11.01-1998.11.06

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