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Out-of-Plane Thermal and Mechanical Properties of Polyimide Thin Films

著者名:
掲載資料名:
Dielectric material integration for microelectronics
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
98-3
発行年:
1998
開始ページ:
272
終了ページ:
278
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771979 [1566771978]
言語:
英語
請求記号:
E23400/98-3
資料種別:
国際会議録

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