Blank Cover Image

Analysis of Nitride Bonding

著者名:
掲載資料名:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
97-36
発行年:
1997
開始ページ:
171
終了ページ:
178
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
言語:
英語
請求記号:
E23400/97-36
資料種別:
国際会議録

類似資料:

1 国際会議録 Applications of Wafer Bonding to Non-Electronic Microstructures

Desmond, C.A., Abolghasem, P.

Electrochemical Society
7 国際会議録 Modeling of gallium nitride optoelectronic devices

Flory,C.A., Hasnain,G.

SPIE - The International Society for Optical Engineering
2 国際会議録 Si-Si PN Junctions Fabricated by Wafer Bonding in UHV

Hobart, K.D., Desmond, C.A., Kub, F.J., Twigg, M.E., Jernigan, G.G.

Electrochemical Society
8 国際会議録 UV/Ozone Activation Treatment for Wafer Bonding

Hobart, K.D., Colinge, C.A., Ayele, G., Kub, F.J.

Electrochemical Society
3 国際会議録 Fabrication of a High-Sensitivity Pressure Sensor with Nitride Membranes and Single Crystal Piezoresistors Using Wafer Bond Etch Back

Desmond, C.A., Mlcak, R., Franz, D.

Electrochemical Society
9 国際会議録 Thin film Au-Sn bonding for optoelectronic integration

Callahan,J.J., Drabik,T.J., Martin,K.P., Fan,C.

SPIE-The International Society for Optical Engineering
4 国際会議録 Low-Temperature Atmospheric Silicon-Silicon Wafer Bonding for Power Electronic Applications

Desmond, C.A., Hobart, K., Kub, F., Campisi, G., Weldon, M.

Electrochemical Society
10 国際会議録 Hydrogen and Nitrogen Loss during ERD Analysis of Silicon(Oxy)nitrides

Wallace,S.G., Kockelkoren,A.C., Boudreau,M.G., Mascher,P., Forster,J.S., Davies,J.A.

Trans Tech Publications
5 国際会議録 Electrical Characteristic of Low Temperature Direct Silicon-Silicon Bonding for Power Device Applications

Kub, F.J., Hobart, K.D., Desmond, C.A.

Electrochemical Society
11 国際会議録 HIGH RESOLUTION X-RAY SPECTROSCOPY FROM THE EINSTEIN OBSERVATORY

Winkler F. P., Canizares R. C., Clark W. G., Markert H. T., Berg C., Jernigan C. J., Schattenburg L. M.

D. Reidel
6 国際会議録 LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE

J.A. Folta, C.B. Hunt, S.N. Farrens

Electrochemical Society
12 国際会議録 Group ?-nitride materials for ultraviolet detection applications

Chow,P.P., Klaassen,J.J., VanHove,J.M., Wowchak,A.M., Polley,C., King,D.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12