Blank Cover Image

Effect of Surface Roughness on the Adhesion of Silicon Wafers Prior to Bonding

著者名:
掲載資料名:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
97-36
発行年:
1997
開始ページ:
56
終了ページ:
63
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
言語:
英語
請求記号:
E23400/97-36
資料種別:
国際会議録

類似資料:

Beggans, M., Farmer, K., Federici, J., Digges, T.G., Jr., Garofalini, S., Hensley, D.

Electrochemical Society

Hesse, P.J., Haas, T.W., Lampert, W.V., Eyink, K.G., Tomich, D.H., Seaford, M.L.

Electrochemical Society

Ljungberg, K., Backlund, Y., Soderbarg, A., Bergh, M., Andersson, M.O.

Electrochemical Society

F. Rieutord, H. Moriceau, R. Beneyton, L. Capello, C. Morales

Electrochemical Society

L.W. Shive, B.L. Gilmore

Electrochemical Society

Roberds, B., Farrens, S.

Electrochemical Society

B.L. You, X.N. Zhang, C. Luo, X.K. Sun, K.F. Wu

Trans Tech Publications

S. An, S.-G. Lee, B.-H. O, H.-H. Kim, S.-G. Park

Society of Photo-optical Instrumentation Engineers

Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A.

Electrochemical Society

Cho K., Lee D., Seo -H. K., Ahn -O. T.

Society of Plastics Engineers, Inc. (SPE)

D.H. Xiang, G.X. Yue, H.T. Liu, B. Zhao

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12