Dielectric CMP Planarization Considerations for Deep Sub-Micron Multilevel Interconnect Processes

Dielectric CMP Planarization Considerations for Deep Sub-Micron Multilevel Interconnect Processes

著者名:

掲載資料名:

Proceedings of the First International Symposium on Chemical Mechanical Planarization

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

96-22

発行年:

1996

開始ページ:

197

終了ページ:

205

総ページ数:

9

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771726 [1566771722]

言語:

英語

請求記号:

E23400/970318

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013855
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society
回次:	1st ; 190th
会議開催地:	San Antonio, Texas, USA
会議開催年:	1996.10.06-1996.10.11

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