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Optimization of the Chemical Mechanical Planarization Process to Build Multilevel Copper Interconnection Structures

著者名:
Murarka, S.P.  
掲載資料名:
Proceedings of the First International Symposium on Chemical Mechanical Planarization
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
96-22
発行年:
1996
開始ページ:
121
終了ページ:
136
総ページ数:
16
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771726 [1566771722]
言語:
英語
請求記号:
E23400/970318
資料種別:
国際会議録

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