Blank Cover Image

Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries

著者名:
掲載資料名:
Proceedings of the First International Symposium on Chemical Mechanical Planarization
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
96-22
発行年:
1996
開始ページ:
110
終了ページ:
120
総ページ数:
11
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771726 [1566771722]
言語:
英語
請求記号:
E23400/970318
資料種別:
国際会議録

類似資料:

Graham, L., Steinbruchel, C., Duquette , D.J., Chen, L.

Electrochemical Society

Sainio, C., Diquette, D.J.

Electrochemical Society

Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J.

Electrochemical Society

Sainio, Carlyn, Duquette, David J.

Electrochemical Society

Steigerwald, J. M., Murarka, S. P., Duquette, D. J., Gutmann, R. J.

MRS - Materials Research Society

Lee, B-C., Duquette, D.J., Gutmann, R.J.

Electrochemical Society

Loparco, L.J., Duquette, D.J.

Electrochemical Society

Liu, J., King, M., Darsillo, M., Baum, T.

Electrochemical Society

Ein-Eli, Y., Abelev, E., Starosvetsky, D.

Electrochemical Society

Lee, C.Y., Duquette, D.J.

Electrochemical Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12