Surface Development During Electroless Copper Deposition

Surface Development During Electroless Copper Deposition

著者名:

掲載資料名:

Proceedings of the Third Symposium on Electrochemically Deposited Thin Films

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

96-19

発行年:

1996

開始ページ:

91

終了ページ:

102

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771696 [1566771692]

言語:

英語

請求記号:

E23400/970102

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013853
シリーズID:	PA00000028
会議名:	Symposium on Electrochemically Deposited Thin Films ; Fall Meeting of the Electrochemical Society
回次:	3rd ; 1996
会議開催地:	San Antonio, Texas, USA
会議開催年:	1996.10.06-1996.10.11

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1 国際会議録 5. STM Study on the Effect of Cyanide during Electroless Copper Deposition Weber, C.J., Pickering, H.W., Weil, K.G. Electrochemical Society	7 国際会議録 Conformal Electroless Copper and Nickel Deposition on MEMS Structures Adams, S.G., Kudrle, T.D., MacDonald, N.C., Neves, H.P., Chen, J-M., Lopatin, S., Maharbiz, M. Materials Research Society
2 国際会議録 The Effect of Additives on the Microstructure of Electroless Copper Weber, C., Pickering, H., Weil, K. Electrochemical Society	8 国際会議録 *ELECTROLESS COPPER DEPOSITION FOR MULTILEVEL METALLIZATION Wong, S. Simon, Cho, James S., Kang, Ho K., Ting, C.H. Materials Research Society
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