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IMPACT OF THE ELECTROCHEMICAL PROPERTIES OF SILICON WAFER SURFACES ON COPPER OUTPLATING FROM HF SOLUTIONS

著者名:
Teerlinck, I.
Schmidt, H.F.
Rotondaro, A.L.P.
Hurd, T.Q.
Mouche, L.
Mertens, P.W.
Meuris, M.
Heyns, M.M.
Vanhaeren, D.
Vandervorst, W.
さらに 5 件
掲載資料名:
Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
95-20
発行年:
1995
開始ページ:
284
終了ページ:
291
総ページ数:
8
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771153 [1566771153]
言語:
英語
請求記号:
E23400/962140
資料種別:
国際会議録

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