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A thin SOI Process Using a Bonding and Etch-Back Method Without Epitaxial Growth

著者名:
掲載資料名:
Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
95-7
発行年:
1995
開始ページ:
191
終了ページ:
200
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771016 [1566771013]
言語:
英語
請求記号:
E23400/952067
資料種別:
国際会議録

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