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Thermal Stress Characteristics and Void Formation in Al(Cu) Interconnects

著者名:
掲載資料名:
Proceedings of the Symposium on Reliability of Metals in Electronics
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
95-3
発行年:
1995
開始ページ:
106
終了ページ:
115
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770972 [1566770971]
言語:
英語
請求記号:
E23400/952063
資料種別:
国際会議録

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