Morphology of Copper Coatings Electroplated in an Ultrasonic Field

Morphology of Copper Coatings Electroplated in an Ultrasonic Field

著者名:

Martins, L.

掲載資料名:

Advanced materials forum II : proceedings of the II International Materials Symposium, Materiais 2003 and XI Encontro Sociedade Portugesa de Materiais - SPM, Campus da Caparica, April 14-16, Caparica, Portugal, 2003

シリーズ名:

Materials science forum

シリーズ巻号:

455-456

発行年:

2004

開始ページ:

844

終了ページ:

848

総ページ数:

5

出版情報:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499410 [0878499415]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013362
シリーズID:	PA00000012
会議名:	International Materials Symposium ; Encontro Sociedade Portugesa de Materiais - SPM
回次:	2003 : 2nd ; 11th
会議開催地:	Caparica, Portugal
会議開催年:	2003.04.14-2003.04.16

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