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Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique

著者名:
掲載資料名:
Silicon carbide and related materials 2002 : ECSCRM2002, proceedings of the 4th European Conference on Silicon Carbide and Related Materials, September 2-5, 2002, Linköping, Sweden
シリーズ名:
Materials science forum
シリーズ巻号:
433-436
発行年:
2003
開始ページ:
361
終了ページ:
364
総ページ数:
4
出版情報:
Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499205 [0878499202]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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