Finite Element Analysis of Thermal Residual Stress in Ceramic Functional Graded Material: Interface Optimization for Residual Reduction

Finite Element Analysis of Thermal Residual Stress in Ceramic Functional Graded Material: Interface Optimization for Residual Reduction

著者名:

掲載資料名:

Functionally graded materials VII : proceedings of the seventh International Symposium on Functionally Graded Materials (FGM 2002), Beijing, China, October 15-18, 2002

シリーズ名:

Materials science forum

シリーズ巻号:

423-425

発行年:

2003

開始ページ:

677

終了ページ:

680

総ページ数:

4

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499151 [0878499156]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013345
シリーズID:	PA00000012
会議名:	FGM : International Symposium on Functionally Graded Materials
回次:	2002 : 7th
会議開催地:	Beijing, China
会議開催年:	2002.10.15-2002.10.18

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