Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI

Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI

著者名:

掲載資料名:

Textures of materials : ICOTOM 13 : proceedings of the 13th International Conference on Textures of Materials, Seoul, Korea, August 26-30, 2002

シリーズ名:

Materials science forum

シリーズ巻号:

408-412

発行年:

2002

開始ページ:

1657

終了ページ:

1662

総ページ数:

6

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499038 [0878499032]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013339
シリーズID:	PA00000012
会議名:	International Conference on Textures of Materials - ICOTOM
回次:	13th
会議開催地:	Seoul, Korea
会議開催年:	2002.08.26-2002.08.30

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