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Molding Analysis for Underfill of Flip-Chip Packages

著者名:
Jong, W.R. ( Chung Yuan Christian University )
Chen, S.C. ( Chung Yuan Christian University )
Lai, C.C. ( Chung Yuan Christian University )
Kuo, T.H. ( Chung Yuan Christian University )
Liu, H.W. ( Chung Yuan Christian University )
Ho, S. ( Ta Hwa Institute of Technology )
Lo, W.Y. ( Ta Hwa Institute of Technology )
さらに 2 件
掲載資料名:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
シリーズ名:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
シリーズ巻号:
62
発行年:
2004
開始ページ:
1689
終了ページ:
1693
総ページ数:
5
出版情報:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
言語:
英語
請求記号:
S42700/62-2
資料種別:
国際会議録

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