Low Profile Packaging Solution for RF-MEMS Suitable for Mass Production

Low Profile Packaging Solution for RF-MEMS Suitable for Mass Production

著者名:

Daeche, Frank ( Infineon Technologies AG )

掲載資料名:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5288

発行年:

2003

開始ページ:

412

終了ページ:

416

総ページ数:

5

出版情報:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

言語:

英語

請求記号:

P63600/5288

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013172
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	2003
会議開催地:	Boston, MA, USA
会議開催年:	2003.11.18-2003.11.20

類似資料:

1 国際会議録 Low Profile Packaging for MEMS Aero-acoustic Sensors John R. Burns, Robert D. White, Joshua S. Krause Materials Research Society	7 国際会議録 Mechanical Characterizations of Laser Microwelds for MEMS Packaging Han, Wei, Pryputniewicz, Ryszard J. Materials Research Society
2 国際会議録 BCB Based Packaging for Low Actuation Voltage RF MEMS Devices David Peyrou, Fabienne Pennec, Hikmat Achkar, Patrick Pons, Fabio Coccetti, Herve Aubert, Robert Plana Materials Research Society	8 国際会議録 MEMS as Low-cost high-volume semiconductor solutions: it's all in the packaging and assembly J. Brown, M. Lutz, A. Partridge, P. Gupta, E. Radza Society of Photo-optical Instrumentation Engineers
3 国際会議録 Packaging of the rf-MEMS switch Park, H.-W., Park, Y.-K., Lee, D.-J., Ju, B.-K. SPIE-The International Society for Optical Engineering	9 国際会議録 Packaging for MEMS devices: stumbling block or enabling solution? Jung, E., Wiemer, M., Grosser, V., Bock, K., Wolf, J. SPIE-The International Society for Optical Engineering
4 国際会議録 Challenges and Solutions for Packaging MEMS and Microsystems Neysmith, J., Baldwin, D.F. Electrochemical Society	10 国際会議録 Automating Metal Lift-Off for Mass MEMS Production J.J. Naughton, P. Franklin Electrochemical Society
5 国際会議録 Packaged MEMS and MOEMS measurement using through-transmissive-media (TTM) profiler [6032-03] Han, S. SPIE - The International Society of Optical Engineering	11 国際会議録 Digital demodulation algorithm for the interferometric characterization of RF MEMS structures Weber, R.A., Tayag, T.J., Shannon, L.J. SPIE - The International Society of Optical Engineering
6 国際会議録 Trends in RF Module Packaging for Wireless Applications Bachner,Frank J., Vardaman,E.Jan, Kale,Vidya IMAPS, SPIE-The International Society for Optical	12 国際会議録 Infrastructure needs for rf MEMS production Heeren,H.van SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12