Flip Chip Bonding Technology for Molded Interconnect Device

Flip Chip Bonding Technology for Molded Interconnect Device

著者名:

Yagi, Yoshihiko ( Matsushita Electric Industrial Col., Ltd. )

Harazono, Fumikazu ( Panasonic System Solutions Company )

さらに 2 件

掲載資料名:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5288

発行年:

2003

開始ページ:

256

終了ページ:

261

総ページ数:

6

出版情報:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

言語:

英語

請求記号:

P63600/5288

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013172
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	2003
会議開催地:	Boston, MA, USA
会議開催年:	2003.11.18-2003.11.20

類似資料:

1 国際会議録 Ultra-Thin & High-Density Packaging Using Both Sides Filip Chip Technology Nishida, Kazuto, Shimiz, Kazumichi, Yoshino, Michiro, Yagi, Yoshihiko, Koguchi, Hideo, Sasaki, Chie IMAPS	7 国際会議録 Comparison of Stud Bump Bonding Technology and Other Flip-Chip Technologies Ono,Masahiro, Shiraishi,T., Bessho,Y., Eda,K., Ishida,T. SPIE - The International Society for Optical Engineering, IMAPS
2 国際会議録 New Flip-Chip Bonding Technology NSD (Non Conductive Film Stud-Bump Direct Interconnection) Method using Resin Encapsulation Sheet Nishida,Kazuto, Nishikawa,Hidenobu, Shimizu,Kazumichi, Otani,Hiroyuki, Koguchi,Hideo IMAPS	8 国際会議録 A Study on Advanced Flip Chip Interconnect Technologies for Space Application Ling,Sharon, Le,Binh, Lew,Ark, Nhan,Elbert, University,Johns Hopkins SPIE-The International Society for Optical Engineering
3 国際会議録 High Density Packaging using Flip Chip Technology in Mobile Communicaton Equipment Nishida, Kazuto, Shimizu, Kazumichi, Yui, Takashi, Honma, Hajime, Matsumura, Nobuya, Okamoto, Izumi, Abe Kouji, Kouzou, … IMAPS	9 国際会議録 Flip Chip Interconnect:A Versitile Known Good Die Technology Chrusciel,Richard W., Delivorias,Peter, Rispoli,Ken SPIE-The International Society for Optical Engineering
4 国際会議録 The Technology of Flip Chip Bonding on an Organic Substrate for PDA Makabe, Akira, Kurashima, Yohei, Shimizu, Statoshi, Inoue, Shigeki IMAPS	10 国際会議録 Preliminary Reliability Evaluation of Flip Chip on Flex Interconnect Technology Virmani, N., Shaw, J. European Space Agency
5 国際会議録 Flip Chip Bonding Technology using Resin for Adhesion Sakamoto,Yasuhiro, Matsubara,Hiroshi, Yamamura,Keiji, Nukii,Takashi SPIE - The International Society for Optical Engineering	11 国際会議録 Evaluation of Alternative Processes for Au-Sn-Au Flip Chip Bonding of Power Devices Debabrata`Dev'Gupta SPIE-The International Society for Optical Engineering
6 国際会議録 Progress on 850-nm-Flip-Chip-Bondable VCSEL for Optical Interconnects Cunningham, J. E., Jan, W. Y., Goossen, K. W., Krishnamoorthy, A., Walker, J. A., Tseng, B., Giaritta, G., Lothian, J., … MRS - Materials Research Society	12 国際会議録 Current and Future 3D-LSI Technology for the Image Sensor Devices Makoto Motoyoshi, Hirofumi Nakamura, Manabu Bonkohara, Mitsumasa Koyanagi Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12