Top-down versus cross-sectional SEM metrology and its impact on lithography simulation calibration

Top-down versus cross-sectional SEM metrology and its impact on lithography simulation calibration

著者名:

Jones, R.L. ( KLA-Tencor Corp. (USA) )
Byers, J.D. ( KLA-Tencor Corp. (USA) )
Conley, W. ( Motorola, Inc. (USA) )

掲載資料名:

Metrology, Inspection, and Process Control for Microlithography XVII

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5038

発行年:

2003

巻:

1

開始ページ:

663

終了ページ:

673

総ページ数:

11

出版情報:

Bellingham, WA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448439 [0819448435]

言語:

英語

請求記号:

P63600/5038

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013025
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
回次:	2003 : 17th
会議開催地:	Santa Clara, California, USA
会議開催年:	2003.02.24-2003.02.27
論文注記:	Top-Down Methods ; 5038-70

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