Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS
- 著者名:
- Hong, S. ( Univ. of Southern California (USA) )
- Ho, T. ( Univ. of Southern California (USA) )
- Zhang, L. ( Univ. of Southern California (USA) )
- Sawchuk, A.A. ( Univ. of Southern California (USA) )
- 掲載資料名:
- Photonics Packaging and Integration III
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4997
- 発行年:
- 2003
- 開始ページ:
- 127
- 終了ページ:
- 134
- 総ページ数:
- 8
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819447975 [0819447978]
- 言語:
- 英語
- 請求記号:
- P63600/4997
- 資料種別:
- 国際会議録
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