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Experimental Study for Underfill of Flip Chip Packages

著者名:
Jong, W-R. ( Chung Yuan Christian University )
Chen, S.
Lai, C.
Tsai, H.
Liu, H.
Ho, S. ( Ta Hwa Institute of Technology )
Lo, W-Y.
さらに 2 件
掲載資料名:
ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee
シリーズ名:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
シリーズ巻号:
61
発行年:
2003
開始ページ:
1335
終了ページ:
1341
総ページ数:
7
出版情報:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780972718011 [097271801X]
言語:
英語
請求記号:
S42700/61-2
資料種別:
国際会議録

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