Contact hole resolution enhancement by post exposure amine treatment (CONPEAT) process

Contact hole resolution enhancement by post exposure amine treatment (CONPEAT) process

著者名:

Koh, C.-W. ( Hynix Semiconductor, Inc. (Korea) )

掲載資料名:

Advances in Resist Technology and Processing XIX

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4690

発行年:

2002

巻:

Part Two

開始ページ:

793

終了ページ:

798

総ページ数:

6

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819444363 [0819444367]

言語:

英語

請求記号:

P63600/4690

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012524
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Advances in resist technology and processing
回次:	2002 : 19th
会議開催地:	Santa Clara, CA, USA
会議開催年:	2002.03.04-2002.03.06

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