Novel Alignment Technologies for Wafer Level Packaging
- 著者名:
- Brubaker, C. ( EV Group US, Inc. )
- Glinsner, T. ( EV Group )
- Lindner, P.
- Schaefer, C.
- Tischler, M.
- 掲載資料名:
- Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4587
- 発行年:
- 2001
- 開始ページ:
- 594
- 終了ページ:
- 599
- 総ページ数:
- 6
- 出版情報:
- Washington, DC: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815646 [0930815645]
- 言語:
- 英語
- 請求記号:
- P63600/4587
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
Materials Research Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
Materials Research Society |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |