Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method

Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method

著者名:

Wang,W.-C. ( National Tsing Hua Univ. )
Liu,Y.-W.

掲載資料名:

Third International Conference on Experimental Mechanics : 15-17 October, 2001, Beijing China

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4537

発行年:

2001

開始ページ:

20

終了ページ:

24

総ページ数:

5

出版情報:

Bellingham, Washington: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819442611 [0819442615]

言語:

英語

請求記号:

P63600/4537

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012251
シリーズID:	PA00000029
会議名:	International Conference on Experimental Mechanics
回次:	2001 : 3rd
会議開催地:	Beijing, China
会議開催年:	2001.10.15-2001.10.17

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