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Development of Thermal Solution for High Power Flip Chip CPU Package

著者名:
Kwon,H.K.
Baek,J.H.
Chun,J.W.
Kim,M.H.
Lee,T.K.
Oh,S.Y.
Ro,Y.H.
さらに 2 件
掲載資料名:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4217
発行年:
2000
開始ページ:
313
終了ページ:
319
総ページ数:
7
出版情報:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
言語:
英語
請求記号:
P63600/4217
資料種別:
国際会議録

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