Development of Thermal Solution for High Power Flip Chip CPU Package
- 著者名:
Kwon,H.K. Baek,J.H. Chun,J.W. Kim,M.H. Lee,T.K. Oh,S.Y. Ro,Y.H. - 掲載資料名:
- 2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4217
- 発行年:
- 2000
- 開始ページ:
- 313
- 終了ページ:
- 319
- 総ページ数:
- 7
- 出版情報:
- Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
- ISSN:
- 0277786X
- ISBN:
- 9780930815608 [0930815602]
- 言語:
- 英語
- 請求記号:
- P63600/4217
- 資料種別:
- 国際会議録
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8
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