Investigation on bridge in QFP and fatigue in BGA based on simulating solder joint formation
- 著者名:
- 掲載資料名:
- Intelligent systems in design and manufacturing
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4192
- 発行年:
- 2000
- 開始ページ:
- 222
- 終了ページ:
- 227
- 総ページ数:
- 6
- 出版情報:
- Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819438577 [081943857X]
- 言語:
- 英語
- 請求記号:
- P63600/4192
- 資料種別:
- 国際会議録
類似資料:
SPIE - The International Society for Optical Engineering |
7
国際会議録
Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint
Trans Tech Publications |
2
国際会議録
Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect
Trans Tech Publications |
8
国際会議録
Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength
Trans Tech Publications |
3
国際会議録
Fatigue Life Prediction of Stainless Steel Laser Lap Joints Based on Natural Frequency Changes
Trans Tech Publications |
Trans Tech Publications |
SPIE - The International Society of Optical Engineering |
Materials Research Society |
SPIE - The International Society of Optical Engineering |
Materials Research Society |
Trans Tech Publications |
Society of Photo-optical Instrumentation Engineers |