Post-Cure Die Attach Delamination

Post-Cure Die Attach Delamination

著者名:

Pare,Patrice ( IBM Canada Ltd. )
Ray,Michel

掲載資料名:

1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

2920

発行年:

1996

開始ページ:

162

終了ページ:

167

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815486 [0930815483]

言語:

英語

請求記号:

P63600/2920

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020753
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	1996
会議開催地:	Minneapolis, Minnesota, USA
会議開催年:	1996.10.08-1996.10.10

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