Finite element analysis of thermal stresses in laser packaging
- 著者名:
Sheen,M.-T. ( National Sun Yat-Sen Univ.(Taiwan) ) Chen,C.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Kuang,J.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Cheng,W.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Chang,H.-L. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,S.-C. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,C. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,C.-M. ( Chunghwa Telecom Labs. (Taiwan) ) Liaw,J.-W. ( Chunghwa Telecom Labs. (Taiwan) ) - 掲載資料名:
- Optoelectronic Materials and Devices
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3419
- 発行年:
- 1998
- 開始ページ:
- 93
- 終了ページ:
- 101
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819428738 [0819428736]
- 言語:
- 英語
- 請求記号:
- P63600/3419
- 資料種別:
- 国際会議録
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